| PART |
Description |
Maker |
| FLATPACK |
Ceramic Flat Pack Package
|
Amkor Technology
|
| CQFP |
Ceramic Quad Flat Pack Package
|
Amkor Technology
|
| PPS-1 |
Metal GlazePower Pack Surface Mount High Power Density Ceramic Package
|
TT Electronics / Welwyn
|
| C1206C2745RAC C1206C6845RAC C1206C68415RAC C1206C3 |
Triple buffer with open-drain outputs, SOT505-2 (TSSOP8), Reel Pack, Reverse
3.3 V 16-bit buffer/driver; 3-state, SOT362-1 (TSSOP48), Tube
3.3 V 16-bit buffer/driver; 3-state, SOT1025-1 (HUQFN60U), Reel Dry Pack, 7" 表面贴装陶瓷电容扩展206，X7R介质500000伏特
Surface Mount Ceramic Chip Capacitors Extended Values 1206, X7R Dielectric, 25, 50, 100, 200 Volts 表面贴装陶瓷电容扩展206，X7R介质5500000伏特
Surface Mount Ceramic Chip Capacitors Extended Values 1206, X7R Dielectric, 25, 50, 100, 200 Volts 表面贴装陶瓷电容扩展206，X7R介质255000200伏特
|
KEMET Corporation
|
| 61063-101 61063 61063-001 |
PHOTODIODE “PILL PACK?/a>
PHOTODIODE PILL PACK
Micropac Industries
PHOTODIODE “PILL PACK”
PHOTODIODE B>PILL PACK
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT06; Number of Contacts:3; Connector Shell Size:8; Connecting Termination:Solder; Circular Shell Style:Straight Plug; Body Style:Straight PHOTO DIODE
PHOTODIODE PILL PACK 光电二极管“丸包装
|
23
22
20
MICROPAC[Micropac Industries]
Micropac Industries, Inc.
|
| TC2996A |
1.6 GHz 12 W Flange Ceramic Packaged GaAs Power FETs
|
Transcom, Inc.
|
| D20NP1R4F5PA D12NP0R4F5PA D12NP0R4B5PA D15NP1R2F5P |
CAPACITOR, CERAMIC, 50 V, NP, 0.0000014 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000004 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000012 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000005 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000024 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000006 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000018 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, NP, 0.0000024 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000008 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000009 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.00000045 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, NP, 0.0000014 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, NP, 0.0000012 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000011 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, NP, 0.0000013 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, NP, 0.000001 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000007 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, NP, 0.0000011 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.00000035 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000017 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NP, 0.0000016 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, NS, 0.000002 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, BJ, 0.000043 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, PG, 0.00000008 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, PG, 0.00000008 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, PG, 0.00000007 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, PG, 0.00000007 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, PI, 0.0000002 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 100 V, PI, 0.00000006 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, 50 V, PI, 0.00000006 uF, SURFACE MOUNT CHIP
|
Dielectric Laboratories, Inc.
|
| 5100145-1 5100145-9 |
2mm Hard Metric PCB Mount Connectors ( Z-PACK 2mm HM ); Z-PACK/B25 RAF 125P ( AMP )
|
Tyco Electronics
|
| 5-100526-2 |
2mm Hard Metric Contacts and Accessories ( Z-PACK 2mm HM ); Z-PACK F.CODING KEY ( AMP )
|
Tyco Electronics
|
| 5-100525-2 |
2mm Hard Metric Contacts and Accessories ( Z-PACK 2mm HM ); Z-PACK M.CODING KEY ( AMP )
|
Tyco Electronics
|
| 5120747-1 |
Z-PACK HS3 Connectors and Accessories; Z-PACK HS3 HDR ASY 10R 50P ( AMP )
|
Tyco Electronics
|
| 5120670-1 |
Z-PACK HS3 Connectors and Accessories; Z-PACK HS3 HDR ASY 10R 50P ( AMP )
|
Tyco Electronics
|
|
